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In-house capabilities

From simulation and component design to precision assembly, alignment and environmental testing 

PHOTONICPARTS combines a broad range of in-house engineering, manufacturing, assembly and characterization capabilities for photonic components and subsystems.

By keeping critical development and manufacturing processes within our own facilities, we can rapidly develop, manufacture and evaluate customized solutions while maintaining close control over materials, interfaces and process parameters.

 

Engineering, CAD and Thermal Simulation

We develop customized photonic components, packages and assemblies from initial concept to manufacturing-ready design.

  • 3D CAD design of components, packages and optomechanical assemblies
  • Thermal simulation and optimization
  • Evaluation of heat flow, temperature distributions and thermal interfaces
  • Design of CTE-matched and low-stress assemblies
  • Development of customized cooling concepts
  • Design for manufacturing and assembly
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Thin-Film Metallization & PVD

 Magnetron sputtering and PVD deposition 

  • Local and full-area solderable metallization
  • Metals and multilayer coating systems
  • PVD deposition of solder and solder alloys
  • Coating of optical crystals, glass, ceramics and metals
  • Customized layer stacks for joining applications
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Vacuum & Flux-Free Soldering

 Precision soldering under controlled atmosphere and vacuum

  • Flux-free soldering
  • Large-area solder joints
  • Low-temperature soldering
  • Local soldering processes
  • CTE- and stress-optimized joining
  • Optical, ceramic and metallic components
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Precision Inspection & Metrology

 High-resolution optical inspection

  • Keyence VHX digital microscopy
  • Inspection of optical facets, solder interfaces and assemblies
  • Dimensional and surface analysis
  • Documentation of development and production samples
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Wire Bonding

 In-house electrical interconnection

  • Wire bonding for laser diode packages
  • Prototype and small-series assembly
  • Integration of electrical and thermal interfaces

 

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Environmental Testing 

Verification under changing environmental conditions

  • Temperature cycling
  • Defined climatic conditions (Temperature & Humidity)
  • Thermal stability testing
  • Shock and vibration testing
  • Evaluation before and after environmental exposure
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High-Precision Optical Alignment 

For demanding optical assemblies, we have dedicated equipment for high-precision positioning and angular characterization.

Our alignment capabilities include:

  • TRIOPTICS autocollimator for high-precision angular measurements
  • 6-axis hexapod micromanipulator for precise positioning and alignment
  • Active alignment of optical components
  • Characterization of angular and positional stability
  • Alignment during development and assembly
  • Integration with our solder-based fixation technologies
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Cleanroom & Controlled Assembly 

  • Clean assembly areas
  • Optical component handling
  • Sensitive photonic assembly
  • Controlled preparation prior to coating, joining and bonding

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High-Power Laser Laboratory 

Our laser laboratory provides the infrastructure required to develop and characterize components and assemblies under realistic high-power laser conditions.

Available capabilities include:

  • High-power ultrashort-pulse laser sources
  • Optical power and energy measurements
  • Beam characterization
  • Beam profiling
  • Evaluation of optical components under high optical power
  • Thermal characterization during laser operation
  • Development and testing of laser and amplifier components
  • Characterization of photonic assemblies under application-relevant conditions



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Design & Simulation → Thin-Film Processing → Precision Joining → Electrical Integration → Alignment → Inspection → Testing 

Looking for a development partner for a challenging photonic assembly? Our combination of engineering, thin-film processing, precision joining, alignment and testing allows us to develop solutions beyond standard component manufacturing.