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Individual solutions for your series production

Designed for highest requirements - individually adaptable

Accelerate your TTP (Time to product)

Keep your focus on your technological goals. We deliver your individual packaging solution.

Industrial proven products

Leveraging our soldering technology and extensive expertise in the high-end laser industry, we develop highly robust and industry-proven products and solutions.

Customizable

 

You provide the specifications and optics – we handle the packaging.

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Photonic Components

Field of application

PHOTONICSPART_Soldered laser crystal packages
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Soldered laser crystal packages
Yb:YAG, Nd:YAG, Yb:KYW …

  • Homogenous heat dissipation over entire crystal surface area
  • CTE-matched heatsink material pairing
  • Active/passive cooled
  • Dimension/dopant concentration of crystal can be adapted to customer’s need 
  • Packaged crystals are not available on the market by now
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Soldered non-linear crystal packages
SHG, THG, OPO

  • CTE-matched heatsink material pairing for NL-crystals
  • Including high precision heater
  • Sealed box to prevent contamination and to extend lifetime
PHOTONICSPART_Soldered non-linear crystal packages
PHOTONICSPART_Soldered optics, lightweight mirrors
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Soldered optics, lightweight mirrors, metal/glass/ceramics composites

  • Possibility of assembling glass/metal/ceramics composites
  • Allows centering, screwing of mounted optics
  • Lightweight design (e.g. ceramics honeycomb)
  • Rear side cooling option

Our processes | Your solution

As the used technology offers wide range market application we are always open for new tasks.
Since we have many relevant processes inhouse, we can easily adapt our technology to customers.

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PHOTONICSPART_High vacuum soldering
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PHOTONICSPART_Pick and Align Robot
PHOTONICSPART_Quality control
PHOTONICSPART_Climate stress testing
  • PHOTONICSPART_CAD Construction and simulation
    CAD Construction and simulation
  • PHOTONICSPART_Ultrasonic cleaning
    Ultrasonic cleaning
  • PHOTONICSPART_Magnetron sputterimg
    Magnetron sputterimg
  • PHOTONICSPART_PVD solder deposition
    PVD solder deposition
  • PHOTONICSPART_High vacuum soldering
    High vacuum soldering
  • PHOTONICSPART_Climate stress testing
    Climate stress testing
  • PHOTONICSPART_Quality control
    Quality control
  • PHOTONICSPART_Clean Room Laser Production
    Clean Room Laser Production
  • PHOTONICSPART_Pick and Align Robot
    Pick and Align Robot

Products and Solutions based on Soldering

Highly precise and robust laser components and subsystems based on soldering technology

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News Blog

CIOE 2023 china

CIOE 2023 china

We will be represented on CIOE 2023 (The 24th China International Optoelectronic Exposition) by our...

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Technology

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large area solder technology for high demanding markets

With PHOTONICPARTS' specialized joining and packaging technology, we can achieve an exceptionally homogeneous, long-term stable, and robust connection between the materials we use. This capability empowers us to manufacture highly robust optical components and subsystems based on soldering technology that are currently unavailable in the market.

Our extensive experience in developing and producing high-performance ultrashort pulse amplifiers and components has provided us with the expertise needed to design and fabricate optimal thermal management solutions for your system. We use PVD (Physical Vapor Deposition), sputtering and high vacuum soldering processes to enable robust solder joints that reduce thermal resistance at the heat source to an absolute minimum. These processes also allow for strain matching (CTE match) and are not constrained by specific surface geometries that require cooling. 

Company

PHOTONICPARTS has been founded as a brand of XCCES GmbH by Dr. Jan Dolkemeyer and Phillip Dittmann in August 2023. The company works in the field of joining and assembly technologies and production of laser components mainly for the photonic market. Beside laser technology itself, the core know-how of PHOTONICPARTS lies in the production of homogeneous large-area solder joints for any materials or material pairings. The focus is usually on the customer's requirement for a thermally stable and robust solder joint with the lowest thermal and electrical resistance between two or more joining partners. Major fields of application are the packaging, adjustment and thermal management of laser crystals, optics and fibre optics in the markets of laser technology, aerospace and quantum technologies.

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partners, network & support

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Phillip Dittmann

 

Phillip Dittmann

Founder & Managing Partner

Phillip Dittmann has more than 12 years experience in the international photonic market due to his work at Fraunhofer ILT and AMPHOS GmbH. During his work at AMPHOS Mr. Dittmann led heterogenous r&d, production and service teams and has deep-technical know-how in the fields of ultra-short-pulse laser technology, high-vacuum solder techniques, mechanical design and optics.

 

 

C88A1526

 

Dr. Jan Dolkemeyer

Founder & Managing Partner

As a scientific assistant at the Fraunhofer Institute for Laser Technology, Dr. Jan Dolkemeyer developed fundamental soldering techniques for sensitive electro-optical components in the field of laser technology. These soldering techniques are an essential core know-how of AMPHOS GmbH, of which he was a co-founder in 2011. AMPHOS GmbH produces high-power ultrafast lasers for material processing. Dr. Jan Dolkemeyer served as managing director overseeing production as well development until the end of 2022 . In 2018, AMPHOS GmbH has been acquired by the Trumpf Group.

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