Photonic Packaging & Flux-Free Soldering

Precision joining for photonic excellence

At PHOTONICPARTS, we specialize in high-performance packaging and assembly solutions for laser and photonic components. Our core expertise lies in flux-free-vacuum soldering, packaging technologies, robust thermal management, and hermetic sealing technologies. From laser crystal packaging to complex optics and subsystems for quantum, we integrate optical elements in a reliable and scalable manner thanks to our advanced joining processes. Whether it’s for high-power laser cooling, quantum applications, or aerospace-grade components – our solutions are made to last and withstand harsh environments.

Our Technology

Flux-free vacuum soldering for optical, metallic & ceramic components
Active surface preparation: Solderable metallization for a wide range of materials
Low-melting solders tailored to thermal & mechanical needs
Thin-film to thick-layer solder deposition via PVD technology
Robust bonding layers with excellent thermal and mechanical stability
Stress-optimized joints – ideal for high-power laser cooling, vacuum and immersion optics
Hybrid assemblies with electrical, optical and fluidic interfaces
Packaging solutions from lab-scale/
demonstrators to industrial series integration