New High-Power Laser Diode Packaging Capabilities | PHOTONICPARTS

PHOTONICPARTS Expands In-House Capabilities for High-Power Laser Diode Packaging

PHOTONICPARTS has expanded its in-house manufacturing capabilities with the addition of a new wire-bonding system.

This investment enables us to perform another critical process step for customized high-power continuous-wave laser diode packages directly within our own facilities in Germany.

High-power laser diode packaging requires much more than simply mounting and electrically contacting a diode. Thermal management, mechanical stability, electrical interconnection and the properties of the individual material interfaces all influence the performance and reliability of the final package.

By bringing wire bonding in-house, we can now integrate electrical interconnection more closely withour existing capabilities in package design,precision soldering and thermal interface engineering.

Combining Thermal and Electrical Integration

One of the key challenges in high-power laser diode packaging is removing heat efficiently from the diode while maintaining reliable electrical and mechanical interfaces.

Our approach considers the complete thermal path from the laser diode through the solder interfaces and package materials to the external cooling system.

Depending on the application, package geometries, materials, solder systems and cooling interfaces can be adapted to the specific diode and operating conditions. Our in-house capabilities also include thermal simulation and CAD design, allowing thermal and mechanical aspects to be considered early in the development process.

With wire bonding now integrated into this process chain, electrical contacting can be developed together with the thermal and mechanical package design rather than treated as a separate process step.

In-House Process Chain

Critical development and manufacturing processes available at PHOTONICPARTS include precision mechanical and thermal design, thin-film metallization, PVD solder deposition, flux-free soldering, wire bonding, optical inspection and testing.

Keeping these processes closely connected allows us to rapidly manufacture and evaluate prototype packages and adapt the design based on the results. Our current in-house capabilities span from CAD and thermal simulation through thin-film processing and precision joining to alignment, inspection and laser testing.

This is particularly useful for applications where standard laser diode packages cannot meet the required thermal, electrical or geometrical constraints.

Customized High-Power Diode Packages

PHOTONICPARTS develops customized packages for high-power CW laser diodes used in demanding photonic applications.

Typical application fields include pump sources for diode-pumped solid-state lasers, high-power CW laser systems, industrial laser technology, scientific laser systems and fusion-related laser applications.

In addition to conventional package concepts, we are also developing solutions using advanced heat-spreading materials such as diamond. These concepts combine efficient thermal transport with electrical insulation directly within the package and can enable new approaches to compact diode integration and cooling.

From Prototype to Repeatable Manufacturing

The new wire-bonding capability is another step towards providing a more complete development and manufacturing chain for customized photonic packages.

From the initial package concept and thermal design through metallization, soldering and electrical contacting to final inspection, we can perform critical process steps directly in-house.

This allows us to support customers not only with individual manufacturing processes, but with the development of complete packaging solutions tailored to their laser diode, cooling concept and application.

Are you developing a high-power laser diode system and looking for a customized packaging solution?

Get in touch with the PHOTONICPARTS team. We would be pleased to discuss your diode, thermal requirements and system architecture and develop a suitable package concept for your application.