High-Power Laser Diode Packages
Customized packaging solutions for efficient thermal management, electrical insulation and reliable high-power operation.
High-power laser diodes place demanding requirements on package design. Efficient heat dissipation, low electrical resistance, mechanical stability and reliable interconnections are essential for achieving consistent performance and long service life.
PHOTONICPARTS develops and manufactures customized packages for high-power continuous-wave laser diodes. Our solutions combine precision soldering, optimized thermal interfaces, wire bonding and application-specific mechanical design in a compact package.
Critical manufacturing and assembly processes are carried out in-house at our facilities in Germany. This enables us to adapt package geometry, materials, electrical configuration and thermal design to the requirements of the individual application.
Designed for Demanding Applications:
Our high-power laser diode packages are suitable for applications such as:
- Pump sources for diode-pumped solid-state lasers
- High-power continuous-wave laser systems
- Industrial laser technology
- Fusion and laser-fusion research
- Scientific laser systems
- Customized photonic and optoelectronic assemblies
Diamond Heat Spreader Technology
For particularly demanding applications, PHOTONICPARTS offers package concepts with an integrated diamond heat spreader.
Diamond combines exceptionally high thermal conductivity with excellent electrical insulation. This allows heat to be transferred efficiently from the laser diode while providing electrical isolation directly within the package.
The integrated insulation offers several advantages:
- Low thermal resistance
- Electrical isolation without additional insulating layers
- Simplified cooling concepts
- Compact arrangement of multiple diode packages
- Increased design flexibility for stacked diode assemblies
- No requirement for DI water in the package cooling circuit
Initial comparative measurements of our development packages indicated an operating temperature approximately 5 °C lower than that of our standard package under comparable test conditions. The actual thermal performance depends on the diode, operating point, package configuration and cooling system.
From Initial Concept to Customized Package
Every high-power diode application has different thermal, electrical and mechanical requirements. We therefore do not treat the package as an isolated component, but consider the complete thermal path from the diode to the cooling system.
Our development process can include:
- Review of the diode geometry and application requirements
- Selection of suitable package and interface materials
- Thermal and mechanical package design
- Precision soldering and assembly
- Wire bonding and electrical contacting
- Prototype manufacturing and initial characterization
- Adaptation of the package for the intended cooling concept
Depending on the project scope, we can support customers from an initial feasibility assessment through prototype development and preparation for repeatable manufacturing.
Your High-Power Diode Packaging Project
Are you developing a high-power laser system and looking for a customized diode package with efficient thermal management and reliable electrical integration?
Contact the PHOTONICPARTS team. We would be pleased to discuss your requirements and develop a suitable package and cooling concept for your application.